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Lead-free double wave soldering machine XD-250M-LF

Wave soldering

Overview:

新颖,采用喷塑工艺不掉漆,经久耐用。

  • Product Details
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    Technical features:
    1. Appearance design: Novel, using spray molding technology without peeling off paint, durable and durable.
    2. Hot air preheating: no blind spot hot air preheating zone, efficient heat conduction; Thick insulation layer, energy-saving and energy-saving
    3. Alloy chain claw: High strength and long service life.
    4. Adjustable nozzle design; The oxidation amount of tin slag is extremely low, and the liquid tin flow design principle is adopted to reduce the impact oxidation amount of tin. The wave peak can be adjusted with the width of the PCB board, greatly reducing the oxidation amount of tin when welding small PCB boards. The adjustable distance is 70-250MM.
    5. Transmission mechanism: Adopting precise modular design, accurate transmission, long service life, and easy maintenance.
    6. Transportation system: closed-loop control. Stepless speed regulation, precise control of PCB preheating and welding time.
    7. Heating system: The temperature adopts PID closed-loop control, ensuring stable and reliable temperature control.
    8. Flux spray device: stepping motor closed-loop automatic tracking spray system, spray width and spray time can be automatically adjusted, and advance and extend spray time can be set as required; Isolation design, pull-out and detachable, easy to clean and maintain;
    9. Control system: Intelligent control program, using branded electrical appliances to ensure stable equipment operation.
    10. Human machine interface: Adopting brand touch screen to ensure system reliability and stability.
    11. Automatic switch on/off: can be carried out according to the date, time, and temperature control parameters set by the user.
    12. Fault prompt: Self diagnosis of system faults, automatic display of causes, and troubleshooting methods available at any time.
    13. Economic operation: Automatic spraying of flux through the board, automatic peaking, minimizing the use of flux and the oxidation of tin.
    14. Protection system: Short circuit and overcurrent protection, providing protection for key electrical components of the equipment.

    Technical parameters:

    PCB board width range

    Max.50~250mm

    PCB board transportation height

    750±50mm

    PCB board transportation speed

    0~2000mm/Min

    PCB board transportation angle (welding angle)

    3~7linear measure

    PCB board transportation direction

    L→R/R→L(optional)

    Height limit of components on PCB board

    Max.100mm

    Peak height range

    0—12mm Adjustable and maintains peak balance

    Wave number

    2

    Length of preheating zone

    350×2=700mm

    Number of preheating zones

    2

    Preheating zone power

    3.5×2=7kw

    Preheating zone temperature

    Room temperature~250 ℃ can be set

    Heating method

    Hot air

    Applicable solder type

    Lead free solder/regular solder

    Tin furnace power

    6kw

    Tin melting capacity of tin furnace

    Approx.120kg

    Solder temperature

    Room temperature~300 ℃, control accuracy ± 1-2 ℃

    Temperature control method

    P.I.D+SSR

    Whole machine control mode

    PLC+Touch Screen

    Flux storage tank

    Max5.2L

    Flux flow rate

    10~100ml/min

    Spray movement mode

    stepping motor

    Power supply

    3-phase 5-wire system 380V

    Starting power (total power)

    max.13kw

    Normal operating power

    Approx.2kw

    Air source

    4~7KG/CM2

    Rack size

    L1450×W1050×H1450mm

    External dimensions

    L2300×W1100×H1550mm

    Weight

    Approx800kg

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