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Process control of reflow soldering

release time:2020-05-07  The number of clicks:2496

The built-in computer control system of the intelligent reflow furnace can easily input various data in the Window operating environment, and can quickly remove or replace the reflow soldering process curve from the memory, saving adjustment time and improving production efficiency.
The purpose of process control is to achieve the two goals of required quality and lowest possible cost. In the past, process control mainly focused on the detection of defects to improve quality; after development, the most fundamental connotation of control is to continuously monitor various processes and find out deviations that do not meet the requirements. Process control is the ability to obtain relevant data in a specific operation that affects the final result. Once a potential problem occurs, it can receive relevant information in real time, take corrective measures, and immediately adjust the process to the best condition. Monitoring the actual process data is the real process control. In reflow soldering process control, it means monitoring the thermal curve of each board manufactured.
An automatic management system that can continuously monitor the reflow soldering furnace can indicate whether the process is out of control before the actual process deviation occurs. This is the Automatic Reflow Management (ARM) system. This system uses continuous SPC histogram , Line balance network, documentation and product tracking constitute a complete software package, and can automatically measure the process data in real time, and make judgments to affect product cost and quality. The basic function of the automatic reflow soldering management system is to accurately detect and automatically Collecting product data through the furnace, it provides the following functions: no need to verify the process curve; automatically collect reflow soldering process data; provide real-time feedback and alarm for zero-defect production; provide automatic SPC chart and correct process capability index for reflow soldering process.

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